NFOEC 2005, March 7, 2005 /PRNewswire-FirstCall via COMTEX/ -- Broadcom Corporation (Nasdaq: BRCM), a global leader in wired and wireless broadband communications semiconductors, today announced a highly integrated optical networking chip featuring leading-edge electronic dispersion compensation (EDC) technology. This low-power, high-performance EDC device extends the transmission distance significantly by maintaining the integrity and quality of the signal, and improves networking efficiency, enabling a seamless, cost-effective upgrade to existing enterprise and metro service transport networks. The Broadcom® solution helps enable the widespread deployment of 10 Gigabit per second (Gbps) optical networks.
As part of the product launch, Broadcom will demonstrate its new BCM8105 optical networking solution that integrates EDC technology over a variety of fiber links. This demonstration will occur at the Optical Fiber Communication Conference & Exposition and National Fiber Optic Engineers Conference (OFC/ NFOEC 2005), located at the Anaheim Convention Center, Booth # 3171, beginning March 8th.
Today's transport networks have a large installed base of legacy fiber links dominated by 1 Gigabit Ethernet (GbE) and OC-48 (2.48 Gbps) optical interconnect data transmissions. The increase in data traffic is driving the need to upgrade those fibers with 10GbE and OC-192 links. However, at the 10 Gbps rate, legacy fiber protocols are subject to dispersion that can limit transmission distance and adversely affect the integrity of the signal itself. To avoid this limitation, EDC technology has proven to be a viable long distance solution by providing the throughput and distance improvements to enhance these legacy fiber applications.
EDC is an important technology, supported by the Optical Internetworking Forum (OIF) -- a group currently defining a 10 Gbps interoperability specification targeting optical links. The transmission distance of this specification supports up to 120 km (2400 ps/nm), however, the maximum distance currently supported is specified at up to 80 km. To achieve this reach extension and lower the cost of optics on existing fiber links, EDC technology, as offered in the new BCM8105 optical networking chip, provides customers a seamless upgrade on existing OC-48 trunks beyond 80 km to OC-192, while enabling the use of low-cost optics without the need to re-engineer the link.
Utilizing a 0.13 micron CMOS process technology and consuming a little over 1 Watt of power, the BCM8105 features 9.9 Gbps to 11.1 Gbps clock and data recovery with a SFI-4 de-multiplexer that incorporates an adaptive EDC equalizer. This capability extends the reach of the signal and improves performance on DWDM (dense wavelength division multiplexing) metro and long-haul SONET/SDH transmission systems.
Based on three previous generations of high-speed CMOS silicon designed for the OC-48, OC-192 SONET/SDH and 10GbE markets, the new BCM8105 device is a multi-rate solution that provides full adaptation on the EDC equalizer with additional automatic tuning on the high-speed receiver threshold and phase levels for BER (bit-error rate) optimization. To provide customers with smooth transitions in rolling out their EDC-based designs, Broadcom has developed a pin-compatible footprint with the BCM8129 CDR de-multiplexer, which is shipping in volume today and offers customers a lower cost high-speed receiver solution without the EDC filter.
"Optical electronic dispersion compensation technology enables Optium to provide solutions to our customers which increase the transmission distance of Optium's industry leading 10 Gbps transceivers by over 50%," said Pete Hallemeier, Vice President of Strategic Marketing, Optium Corporation. "The EDC solution has no physical size impact, minimal power increase, and interoperates on existing links to improve optical bit-error rate performance and transmission distance. In order to exceed our customer commitments, Optium has been working with Broadcom on the BCM8129 and now the BCM8105 to enable an easy upgrade path for customers to next generation 10Gbps optical modules."
For this chip development, Broadcom worked closely with its customers to help define, design and test next-generation systems using beta silicon that includes the EDC equalizer on-chip. As a result, the BCM8105 device was defined specifically to solve the dispersion issues associated with metro and long-haul SONET/SDH transmission links, enabling customers to move forward with EDC technology today.
"Harris Corporation is well known as a world-class provider of optical communications products. In servicing the 300-pin MSA 10GbE optical transponder market, we have helped lead the way in developing the Optical Internetworking Forum (OIF) requirements for OTN Interoperability at Long Reach (LR) and Very Long Reach (VR) link distances," stated Jerry Wood, director of Active Fiber Optic Products at Harris. "Testing beyond 120 km shows that Broadcom's new BCM8105 low-power CDR/Demux, with electronic dispersion compensation, more than satisfies the requirements for these performance-driven applications, providing a solution that we can take to market today."
Broadcom has a complete line of 2.5 Gbps and 10 Gbps products covering both SONET/SDH and the growing 10GbE market. The breadth of Broadcom's product portfolio gives customers a one-stop shop for all of their high-speed interconnect needs with technology that is unmatched in the industry today.
Availability and Packaging
Sampling now to key customers, the BCM8105 is housed in a 15mm x 15mm PBGA package. Pricing is available upon request.
About Broadcom
Broadcom Corporation is a global leader in wired and wireless broadband communications semiconductors. Our products enable the convergence of high-speed data, high definition video, voice and audio at home, in the office and on the go. Broadcom provides manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices with the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions. These solutions support our core mission: Connecting everything®.
Broadcom is one of the world's largest fabless semiconductor companies, with annual revenue of more than $2 billion. The company is headquartered in Irvine, Calif., with offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at 1-949-450-8700 or at www.broadcom.com.
Safe Harbor Statement under the Private Securities Litigation Reform Act of 1995:
All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward- looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.
Important factors that may cause such a difference for Broadcom in connection with the BCM8105 product include, but are not limited to, general economic and political conditions and specific conditions in the markets we address, including the volatility in the technology sector and semiconductor industry, trends in the optical networking market in various geographic regions, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; the rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for enterprise networking applications; delays in the adoption and acceptance of industry standards in those markets; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; our ability to scale our operations in response to changes in demand for our products and services; our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; the gain or loss of a key customer, design win or order; competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products; the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; changes in our product or customer mix; the volume of our product sales and pricing concessions on volume sales; intellectual property disputes and customer indemnification claims and other types of litigation risk; the availability and pricing of third party semiconductor foundry and assembly capacity and raw materials; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the risks of producing products with new suppliers and at new fabrication and assembly facilities; the effects of new and emerging technologies; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; the quality of our products and any remediation costs; the effectiveness of our expense and product cost control and reduction efforts; the risks and uncertainties associated with our international operations, particularly in light of recent events; the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; the level of orders received that can be shipped in a fiscal quarter; and other factors.
Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement for any reason.
Broadcom®, the pulse logo, Connecting everything®, the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.
Mike He
Public Relations Manager
408-922-8083
mhe@broadcom.com
Broadcom Investor Relations Contact
T. Peter Andrew
Sr. Director, Investor Relations
949-926-5663
andrewtp@broadcom.com
Broadcom Technical Contact
Michael Furlong
Sr. Product Line Manager
949-926-6538
mfurlong@broadcom.com
SOURCE Broadcom Corporation




